Digit-Concept | Microelectronics & HighTech Equipement | Failure analysis products | Plasma treatment products

ASAP-1 IPS

Michael — 2011-01-09T00:02:43Z

SESAME 777Cu

Michael — 2011-01-08T23:47:33Z

KEY APPLICATIONS

Designed specifically for decapsulation of copper wired devices
Fast IC Decapsulation etch times
Easily opens even the most delicate packages
Compact design, small footprint

PRODUCT HIGHLIGHTS
Active System Pressure Monitoring (ASM)
Very short heat-up times
Liquid sensors to alert the operator of acid leak
6-year pump warranty
Etch Head lifetime warranty

The SESAME 777 is an Automated Mixed Acid Decapsulator, with advanced feature integration to enable high productivity.

This Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to the package with no sample damage.

An exclusive acid delivery function can be selected that delivers the highest pulse rate possible while consuming less than maximum acid volume.

The SESAME 777 operates at temperatures up to 250oC enabling operational versatility with any combination of acids.

The monolithic etch head is machined from premium grade silicon carbide for unsurpassed acid resistance.

The device hold down assembly (ram nose) is pneumatically activated and is designed for a large amount of travel.

The SESAME 777 is the only Decapsulator to incorporate true double containment for all fluid couplings between the bottle container and the decapsulator.

The Bottle Box Assembly and the Etcher Unit contain fluid sensors to alert the operator in the unlikely event of an acid leak from any of the bottles or internal fittings.

SESAME 707

Michael — 2011-01-08T23:40:27Z

KEY APPLICATIONS

Fast IC Decapsulation etch times
Easily opens even the most delicate packages
Compact design, small footprint

PRODUCT HIGHLIGHTS
Active System Pressure Monitoring (ASM)
Very short heat-up times
Liquid sensors to alert the operator of acid leak
6-year pump warranty
Etch Head lifetime warranty

The SESAME 707 is an Automated Mixed Acid Decapsulator, with advanced feature integration to enable high productivity.

This Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to the package with no sample damage.

An exclusive acid delivery function can be selected that delivers the highest pulse rate possible while consuming less than maximum acid volume.

The SESAME 707 operates at temperatures up to 250oC enabling operational versatility with any combination of acids.

The monolithic etch head is machined from premium grade silicon carbide for unsurpassed acid resistance.

The device hold down assembly (ram nose) is pneumatically activated and is designed for a large amount of travel.

The SESAME 707 is the only Decapsulator to incorporate true double containment for all fluid couplings between the bottle container and the decapsulator.

The Bottle Box Assembly and the Etcher Unit contain fluid sensors to alert the operator in the unlikely event of an acid leak from any of the bottles or internal fittings.

SESAME 500

Michael — 2010-11-08T18:26:41Z

Product Highlights

TableTop Equipement
SESAME 1000 LASER Quality
Cost-effective
Upgradable
easy to use software

SESAME 2000 OPTION

Michael — 2010-11-08T17:17:08Z

Product Highlights

Circuitry can often be revealed without acid
Complex-shaped cavities can be produced
Exposure of components without destruction of Al, Cu, Au
In subsequent acid clean-up operations, low temperature, low corrosion conditions can be used

SESAME 2000 Laser + Plasma Ablation System has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple dice.

At the system's heart is a Nd:YAG 1064nm diode-pumped LASER, which is housed inside a chamber to provide full protection from LASER radiation, in compliance with applicable VBG 93, DIN EN, and CE standards. The integrated optical vision system provides constant sample monitoring. A previously-taken X-Ray or an Acoustic Microscope image can be superimposedonto the SESAME's live component image to provide additional data for successful decpasulation.

SESAME's intuitive software incorporates drawing tools for definition of the material to be removed which can be drawn onto the component image. The actual amount of material removed can be measured by camera focal-depth techniques or by using an external mechanical indicator.

Prior to the LASER ablation process, the component is scanned by a red pilot LASER. The system's firmware controls all process parameters such as power, frequency, scan speed and focal distance. All process parameters can be stored by specific component and product family for easy recall. Following laser ablation, the die surface can be revealed with a low temperature wet etch, applied either manually (with a suitable dropper) or automatically (with an automated acid decapsulation machine), avoiding electric and mechanical alteration of the component.

NOTE: SESAME 2000 Technology incorporates mutual Patents and IP developed by CNES, BSET EQ and DIGIT CONCEPT SA

Contact us

admin — 2009-07-03T12:34:14Z

Guerville F-14740 Secqueville-En-Bessin
Tél: +33 (0) 231 354 354

Fax: +33 (0) 231 354 355

email: info digit-concept.com

A few words about us

The founders of DIGIT CONCEPT have over 20 years of experience in Failure Analysis techniques, products and their applications. We are also knowledgeable in Plasma treatment technologies. We perform service on all equipments for HighTech industry, and we can develop recipes for decapsulation processes.

Brand new and Used equipments

In the scope of this core business of ours, we also propose brand new and also second-hand equipments for sale.

Customer Service

We perform high quality maintenance, under contract or on demand.

For more information feel free to contact us by email : info digit-concept.com

WORLD WIDE DISTRIBUTION NETWORK FOR SESAME SERIES

ASIA China, Malaysia, Thailand, Singapore, Korea, the Philippines, Taiwan, Japan

EUROPE Austria, Belgium, Czech Republic , France, Germany, Hungary, Ireland, Italy, Malta, Netherlands, Portugal, Romania, Scandinavia, Spain

AMERICA United States of America, Canada, Mexico

SIFT (OBIC), EMMI BACK-SIDE, CL, FMI, MOIRÉ

admin — 2009-07-03T10:44:41Z

MULTIWAVES MICROSCOPE

admin — 2009-07-03T10:43:49Z

ATOMIC FORCE PROBE (AFP)

admin — 2009-07-03T10:42:56Z

ARC-Lite

admin — 2009-07-03T10:42:18Z